MWC, 26 Feb 2018, Barcelona, Spain

February 26 - March 01
Barcelona, Spain

Mobile World Congress is the world’s largest gathering for the mobile industry, organised by the GSMA and held in the Mobile World Capital Barcelona, 26 February - 1 March 2018

EVENT INVITE

To make an appointment, please contact : OEMProducts@WDC.com

Embedded World 2018 Invite

Featured Products

iNAND 8521 UFS EFD

iNAND® 8521 UFS2.1 EFD (Embedded Flash Drive) is our most advanced flash storage solution built on the latest 3D NAND technology. With exceptional Read and Write performance, the iNAND 8521 EFD is designed to deliver a fast, smooth user experience for the most data-intensive flagship mobile devices, as well as thin-and-light compute products.

iNAND 7550 e.MMC EFD

Built with the latest 64-layer 3D NAND technology. e.MMC 5.1 with SmartSLC delivers performance and endurance. Designed for mid to high-end mobile and thin-and-light compute devices.

SanDisk Extreme A1 256GB microSD Card

Maximize the performance of your smartphone, tablet or camera. Capture more fast action and record more Full HD or 4K UHD video2 with your Android based smartphone, interchangeable-lens camera, drone or GoPro action camera. Rated A1 for faster app performance to launch and load apps faster than ever before.

blogs

IoT: Context Lives at the Edge

The rising popularity of edge and fog computing in recent years is enabling more informed decisions. A big reason is...

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Storage and the IoT: What kind of storage is needed, and where?

While the cloud is all about elasticity, security and long-term data retention, it’s not the only place where storage is important. Devices at the edge will need local storage both for data capture and support of real-time analytics.

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Videos

3D NAND Enables Data to Thrive

Flash Storage Driving Connected Cars to an Autonomous Future

Maximize the Performance of Your Smartphone with SanDisk® Extreme microSD Card

Whitepaper

  


COUNTERPOINT WHITE PAPER:
RACE TO 3D NAND ACCELERATES IN 2017

The NAND Flash demand has been growing almost exponentially, much of which is attributed to the growth of the avg. capacity in smartphones. To meet the growing demand and increase NAND bit outputs, the storage memory suppliers are transitioning from 2D NAND to 3D NAND technology & manufacturing, a necessary technology transition. This whitepaper analyzes and highlights the demand drivers for NAND Flash memory followed by the status of the supplier landscape in transitioning to 3D NAND technology, the benefits of 3D NAND (especially the move to TLC) and recommendations to suppliers to sufficiently meet the exploding demand.

 

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WHITE PAPER: WESTERN DIGITAL AND THE 3D NAND REVOLUTION

Western Digital’s 3D NAND technology (BiCS) marked important milestones in 2017 with the announcement of BICS3 64 layer based SSD, Embedded and Retail products, introduction of Four bit per cell (X4) SSD, and sampling of BICS4 96 layer 4th generation die, positioning WDC as an industry leader by realizing the cost, performance, power and reliability promise of 3D NAND technology.

 

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