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Automobile Intelligence Key Technology Forum 2019 - May 9, 2019 | Shanghai

May 09 - May 09
Shanghai, China

Event Location 

Sorl Hotel Shanghai
No. 6966, Boyuan road, Anting Town Jiading District, Shanghai

Date and Time

May 09, 2019 | 13:00-17:30

Event Agenda

Time Topics Speaker


Registration -
13:30-13:35 Welcome Speech Steven Craig, VP and China GM, WDC
13:35-14:00 Intelligent Cockpit Market and Technology Development Trend Interpretation Baicheng SONG, Senior Analyst, Gasgoo Institute
14:00-14:40 Storage of Intelligent Vehicle Enters the 3D Era Maya Zhang, Product Marketing Director, WDC


Diversified Applications of Hypervisor-based i.MX Platform and Intelligent Cockpit Xiaoshu Zhai, Marketing Manager, NXP
15:10-15:30 3D NAND in Depth Jason Ji, Principle Field Engineer, WDC
15:30-15:50 Tea Break  
15:50-16:15 The Latest Intelligent Cockpit Building the Future Mobility Liangtu Dong, Product Director, Harman China
16:15-16:45 R-Car Automotive Cockpit Solution Renesas
16:45-17:15 Autonomous Driving Changing the Future Mobility Frank Chen, Autonomous Driving Senior Manager, Ford Motor

Panel Discussion: 4 guests -
Lucky draw and Closing  



Utilizing advanced featuers for your automotive and surveillance applications,The strengths of flash storage are clear: small, fast and reliable under the most demanding of environmental conditions. But what about the challenges of data integrity and data security, especially for critical automotive and surveillance applications? Fortunately, there is an answer that addresses these issues. The implementation of the proprietary Flash Health Monitor and Host Lock provide OEMs with the data integrity and data security needed to meet the demands of an increasingly connected world.


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The 3D NAND Revolution

Understanding 3D NAND Technology and Its Future Challenges,Western Digital’s 3D NAND technology (BiCS) marked important milestones in 2017 with the announcement of BICS3 64 layer based SSD, Embedded and Retail products, introduction of Four bit per cell (X4) SSD, and sampling of BICS4 96 layer 4th generation die, positioning WDC as an industry leader by realizing the cost, performance, power and reliability promise of 3D NAND technology.



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